Test Ability.
Assembly&Test Technical Services
One stop service, close to customer needs, can provide a complete set of packaging and testing solutions including packaging design, packaging, testing, FA failure analysis, reliability verification, etc. A complete range of power device packaging categories, including diodes, transistors JFET、MOSFET、IGBT、 Controllable silicon, power module, etc.
欢迎新老客户前来洽谈、咨询业务,期待着与您携手共进、共创双赢
Test Ability.
testing capability
Complete power device packaging technology, including soft solder, silver paste, solder paste, nano sintered silver bonding technology, aluminum wire/strip, gold copper wire, copper clip bonding technology, and high reliability device packaging and testing technology.
Assembly&Test Technical Services
Copyright © 2025 Xi'an GUIYU Microelectronics Co., Ltd Technical Support:xdnet