Various encapsulation forms implemented
Ceramic packaging
1.1 CDIP Black Porcelain Glass Fusion Encapsulation
Glass is widely used as the airtight sealing material for ceramic packaging and the adhesive material for fixing silicon chips on alumina substrates in the IC field.
1.2 SBDIP multi-layer ceramic dual in-line package
Ceramic dual in-line shell is a type of direct insertion shell, commonly with a lead length of 2.54mm, which has specific characteristics of good thermoelectric performance and high reliability.
1.3 CDFN Ceramic Shell Packaging
CDFN ceramic shell packaging is used for small, high-precision devices. Its shape and thickness are smaller and thinner than plastic packaging (SOIC, TSOP), smaller than CLCC ceramic shell, and compatible with plastic packaging DFN. Mainly used for airtight packaging of semiconductor discrete devices, analog circuits, etc. Product thickness: ≤ 1.20mm
1.4 High strength CSOT ceramic shell packaging
The high-strength CSOT ceramic shell has the characteristics of small volume and light weight, which is suitable for the development of device packaging in modern electronic products with high portability requirements. It can drive the development of ceramic shells for small and medium-sized integrated circuits and semiconductor discrete devices towards smaller, thinner, and better heat dissipation chip level packaging, meeting the needs of integrated circuits to develop towards large-scale and ultra large scale.
Ceramic flexural strength: ≥ 400MPa. Replace plastic sealed SOT
1.5 CFP Ceramic Flat Shell Packaging
Ceramic flat shell (CFP) commonly uses lead pitch of 1.27mm, 1.0mm, small pitch of 0.80mm, 0.635mm, 0.50mm, characterized by small volume and light weight.
1.6 CQFP Ceramic Four Sided Lead Flat Shell Packaging
Ceramic quad lead flat shell (CQFP) has small volume, light weight, high packaging density, good electrical performance, suitable for surface mounting, and is suitable for various large-scale integrated circuit packaging. The commonly used lead pitch includes 1.27mm, 1.0mm, 0.80mm, 0.65mm, and 0.50mm.
1.7 CLCC Ceramic Leadless Chip Carrier Packaging
The commonly used lead pitch for ceramic leadless chip carriers (CLCC) is 1.27mm, 0.50mm, etc. CLCC is suitable for surface installation, with small parasitic parameters, small size, light weight, good heat dissipation, and easy installation of heat sinks.
1.8 CSOP ceramic small outer shell packaging
Ceramic small outer shell (CSOP) is a miniaturized mounting shell, and its wing shaped leads help alleviate stress between the shell and PCB, improving reliability.
1.9 SMD surface mounted power device enclosure packaging
The surface mounted power device housing is welded with high thermal conductivity electrodes, metal sealing rings, and ceramic bases, and has the characteristics of small size and light weight, suitable for high-power transistor packaging.
