FIB (Focused Ion Beam) technology plays a crucial role in chip analysis, particularly demonstrating its powerful capabilities in chip failure analysis. FIB technology has become a key tool for solving complex chip failure problems by accurately processing and analyzing chips at the nanoscale. Its high precision, flexibility, and timeliness enable engineers to accurately locate failure points, analyze failure causes, and provide strong basis for chip improvement and optimization.
In chip failure analysis, the high precision and flexibility of FIB technology enable precise cutting and fabrication of chip profiles, exposing internal structures and helping engineers identify potential defects and failure mechanisms. This technology not only performs well in the analysis of automotive grade chips, but is also widely used in the failure analysis of other complex chips.
1. FIB instance
FIB position
Specific location and coordinates of the cutting point
FIB post image
