FIB (Focused Ion Beam) technology plays a crucial role in chip analysis, particularly demonstrating its powerful capabilities in chip failure analysis. FIB technology has become a key tool for solving complex chip failure problems by accurately processing and analyzing chips at the nanoscale. Its high precision, flexibility, and timeliness enable engineers to accurately locate failure points, analyze failure causes, and provide strong basis for chip improvement and optimization.

Semiconductor testing is a core link that runs through the entire semiconductor industry chain, involving chip design, wafer manufacturing, and packaging processes to ensure product yield. During chip testing, ESD test metrics serve as key indicators reflecting chip reliability.